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MIRTEC unveiled its MS-11 In-Line SPI System at
Productronica. This revolutionary SPI system uses 'Shadow Moire
Technology' and 'Phase Stepping Image Processing' to inspect
solder paste deposition on PCB's post screen print. Far
superior to laser SPI technology, the MS-11 will inspect for:
insufficient solder, excessive solder, shape deformity, shift
of deposition and bridging.
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